BOE's Glass Substrates Signal China's AI Chip Packaging Push
BOE Technology Group has sampled glass-based carrier substrates for advanced semiconductor packaging to domestic Chinese customers, with some clients progressing to technical testing after concept verification. Backed by over RMB 1.3 billion in investment since 2022, BOE's pilot line reached full automation in H1 2026 with capacity for 1,000 substrates per month. This marks a meaningful step in China's effort to build domestic alternatives to Japanese and U.S.-aligned packaging substrate suppliers — a supply chain gap that export controls have made strategically urgent.